Taipei: Taiwan's Foxconn, formally known as Hon Hai Precision Industry Co., has announced a strategic partnership with Intel Corp. to jointly develop AI infrastructure, edge AI, and physical AI solutions. The collaboration aims to combine Intel's processors, silicon photonics technology, and software ecosystem with Foxconn's expertise in global manufacturing, system integration, and AI data center deployment.
According to Focus Taiwan, the partnership will explore end-to-end AI solutions, including chips, racks, systems, and applications, to accelerate the adoption of edge AI and physical AI technologies. In the AI rack segment, the companies plan to develop and commercialize rack-scale AI infrastructure solutions, including those based on Intel Xeon processor architectures and AI accelerators.
The collaboration will emphasize key technologies such as high-speed interconnects, thermal management, liquid-cooling systems, system monitoring, and AI data center scalability to enhance performance and energy efficiency. The companies will focus on next-generation edge AI and physical AI platform architectures, targeting applications in agentic AI, intelligent devices, and robotics.
The partnership is expected to support diverse use cases, including smart manufacturing, smart cities, automotive applications, and robotics. Additionally, the two companies will explore cooperation in custom application-specific integrated circuits (ASICs), systems-on-chip (SoCs), and system integration design services, leveraging Intel's semiconductor technologies and Foxconn's manufacturing ecosystem to expand global market opportunities.
Foxconn Chairman Young Liu emphasized that the partnership will harness the strengths of both companies in computing platforms, system integration, and global supply chains to build next-generation AI infrastructure and advance the commercialization of AI applications. Intel CEO Lip-Bu Tan highlighted the rapid growth of AI, particularly large-scale inference and agentic AI workloads, and the need for innovation across the technology stack to meet these demands.
Tan noted that the collaboration combines expertise in chip design, rack-scale solutions, and global system integration, which will help accelerate the development of end-to-end AI platforms and expand the global impact of AI.