Taipei: MediaTek Inc., Taiwan’s largest chip designer, announced its adoption of Taiwan Semiconductor Manufacturing Co.’s (TSMC) advanced 2-nanometer process for its next flagship system on a chip (SoC), which is poised to enter mass production in the latter half of this year. The SoC has successfully completed the tape-out stage, where the final design is prepared for manufacturing, and is slated to be available by the end of 2026.
According to Focus Taiwan, MediaTek did not disclose the name of the chip, but international media speculates it might be the Dimensity 9600, a next-generation mobile flagship aimed at bolstering MediaTek’s global stance in advanced semiconductor technologies. MediaTek President Joe Chen emphasized that the partnership with TSMC has empowered the company’s flagship chips to deliver efficient solutions across various products, spanning from edge applications to cloud services.
The company underscored its long-standing collaboration with TSMC in mobile platforms, computing, automotive electronics, and data centers. The new SoC exemplifies the robustness of their relationship. Kevin Zhang, TSMC’s deputy co-COO and senior vice president of business development and global sales, remarked that the 2nm process signifies TSMC’s foray into nanosheet transistor structures, reflecting its commitment to advancing technologies to meet client demands and improve computing performance and energy efficiency.
Zhang further noted that the collaboration with MediaTek illustrates TSMC’s ambition to cater to a wide array of applications. MediaTek joins several other companies, including Apple Inc., Nvidia Inc., and Advanced Micro Devices Inc. (AMD), in adopting TSMC’s 2nm node for future product releases.
TSMC’s website states that the 2nm process will be the most advanced globally in terms of density and energy efficiency, providing significant improvements in performance and power consumption.
