Taipei: Taiwan-based smartphone IC designer MediaTek Inc. has introduced its latest flagship 5G Agentic AI chipset, the Dimensity 9500, which utilizes Taiwan Semiconductor Manufacturing Co.’s (TSMC) advanced third-generation 3-nanometer process. Powered by TSMC’s 3nm technology, which recently began mass production, the Dimensity 9500 features an ultra-core processor that achieves up to 55 percent lower power consumption at peak performance, MediaTek announced.
According to Focus Taiwan, MediaTek stated that the Dimensity 9500 offers up to 32 percent higher single-core and 17 percent higher multi-core performance compared to its predecessor. The company emphasized that this chipset is designed to set new standards in on-device AI, console-class gaming, and power efficiency, aiming to drive the next wave of flagship 5G smartphones.
JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit, remarked, “As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life.” He added that the Dimensity 9500 provides breakthrough on-device AI, top-tier performance, efficiency, and a comprehensive suite of premium experiences for users worldwide.
MediaTek revealed that the first smartphone featuring the Dimensity 9500 is expected to launch in the fourth quarter of this year, with Chinese brands Vivo and OPPO reportedly planning to release new phones in October incorporating the new chipset.
Additionally, MediaTek recently announced its adoption of TSMC’s 2nm process, which is set to enter mass production in the latter half of this year, for its upcoming flagship system-on-chip (SoC). Having completed the tape-out stage, the new SoC is anticipated to be available by the end of 2026. International news media have speculated that this next-generation SoC might be named the Dimensity 9600, as part of MediaTek’s strategy to enhance its global presence in cutting-edge semiconductor technologies.
